Stress assessment for device performance in three-dimensional IC: linked package-scale/die-scale/feature-scale simulation flow

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چکیده

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ژورنال

عنوان ژورنال: Journal of Micro/Nanolithography, MEMS, and MOEMS

سال: 2014

ISSN: 1932-5150

DOI: 10.1117/1.jmm.13.1.011203